Influence of vacuum annealing on the dispersion of thin double niobium-copper films deposited onto oxide materials

I. I. Gab; T. V. Stetsyuk; D. B. Shakhnin

doi:10.15330/pcss.21.2.332-337

Authors

I. I. Gab Frantsevich Institute for Materials Science Problems of NAS of Ukraine
T. V. Stetsyuk Frantsevich Institute for Materials Science Problems of NAS of Ukraine
D. B. Shakhnin University "Ukraine"

DOI:

https://doi.org/10.15330/pcss.21.2.332-337

Keywords:

kinetics, dispersion, niobium-copper film, oxide materials

Abstract

The kinetics of dispersion of thin niobium-copper films deposited onto leucosapphire, alumina and zirconia ceramics and annealed in vacuum at temperatures up to 1100 °C with different exposition times at each temperature (from 5 up to 20 min) was studied. The double films consisted of two layers: the first metallization layer was 150 nm niobium nanofilm deposited onto the oxide surface, and the second copper layer 1,5 mm thick deposited over the first one as a solder was used for joining of metallized oxide samples. It was found that these films remain rather dense during heating up to 1050 °C; and after annealing at 1100 °C they decompose into individual fragments covering about 80% the area of the ceramic substrates even after annealing during 20 min. The kinetic curves for the dispersion of these films were plotted.

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